HFM256GD3JX013N
User Benchmarks
| Model | Type | Score | Seq. Read MB | Seq. Write MB | Read 4k64QD | Write 4k64QD | Read Access msek. | Write Access msek. |
| HFM256GD3JX013N | 256 | 0 | 0 | 0 | 0.00 | 0.00 |
The measurement of the HFM256GD3JX013N was carried out on Windows. Similar read and write speeds could certainly be achieved with the HFM256GD3JX013N under Linux and MacOS. Of course, the correct hard drive driver should be installed and the correct interface for the HFM256GD3JX013N should be used.
The HFM256GD3JX013N is a memory chip from Hynix Semiconductor that belongs to the eMMC (embedded MultiMediaCard) modules. These modules are integrated in a wide range of applications as internal storage. Here is the detailed information about this model:
1. General Description
The HFM256GD3JX013N is a 256 GB eMMC memory module designed for use in mobile devices, embedded systems and other storage applications. eMMC is a memory technology that combines NAND flash memory in a compact format with an integrated controller unit.
2. Technical Details
- Capacity: 256 GB. This memory module offers a large storage capacity, ideal for applications that require large amounts of data, such as in smartphones, tablets and embedded systems.
- Form Factor: BGA (Ball Grid Array). The module is integrated in a compact BGA package that is mounted directly on the printed circuit board (PCB), saving space and ensuring a reliable connection.
- Interface: eMMC 5.1. This version of the eMMC interface supports faster data transfer and improved performance compared to previous versions.
- Data Transfer Rates:
- Read: Up to 250 MB/s. The high read speed enables fast data access and transfer.
- Write: Up to 125 MB/s. The write speed is also high, allowing for speedy data storage.
- NAND Flash Type: MLC (Multi-Level Cell) or TLC (Triple-Level Cell), depending on the specific variant of the module. MLC offers higher performance and durability than TLC, while TLC offers greater storage capacity at a lower cost.
- Lifespan and Durability: eMMC memory generally has good durability, aided by wear-leveling algorithms that evenly distribute the wear and tear on the NAND memory.
- Power Consumption: Very low power consumption compared to other memory technologies, making it ideal for battery-powered devices.
3. Features
- eMMC 5.1 Support: This version offers improvements in performance and efficiency, including higher data transfer rates and better flash memory management.
- Wear Leveling: Built-in Wear Leveling technology helps extend memory life by evenly distributing writes across memory cells.
- TRIM Support: eMMC 5.1 supports TRIM commands, which help maintain memory performance by resetting blocks of data that are no longer needed.
- ECC (Error-Correcting Code): Built-in error correction mechanisms ensure data integrity and correct errors that may occur during data storage.
4. Application
- Mobile Devices: Ideal for smartphones, tablets and other portable devices that require a compact and high-performance storage solution.
- Embedded Systems: Suitable for embedded systems in automobiles, industrial applications and consumer products where reliable and durable storage is required.
- Consumer Electronics: Used in a wide variety of electronic products such as digital cameras, game consoles and GPS devices.
- Wearable Technology: Perfect for wearable technologies such as smartwatches and fitness trackers that require compact and energy-efficient storage.
5. Special Features
- High Capacity and Performance: With 256 GB capacity and high data transfer rates, the HFM256GD3JX013N offers a high-performance storage solution for modern applications.
- Compact design: The BGA package enables space-saving integration on circuit boards, which is an advantage for compact devices and applications.
- Energy efficiency: The low power consumption makes the module ideal for battery-operated devices, which extends battery life.
- Reliability: The built-in wear-leveling technology and ECC ensure high reliability and a long memory life.
In summary, the Hynix HFM256GD3JX013N eMMC memory module offers a powerful and reliable storage solution for a wide range of applications. With its high capacity, fast data transfer rates and compact design, it is ideal for modern electronic devices and embedded systems.
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HFM256GD3JX013N and the compatible operating systems
Windows Server 2025, 2022, 2019, 2016, ... or 2008 and higher
Windows 12, 11, 10 or Windows 7 and higher
Linux (various distributions)
macOS (from version 10.6)
Please note that the exact functions and areas of application may vary depending on the firmware version and configuration of HFM256GD3JX013N.
The HFM256GD3JX013N is a reliable disk in case of problems, failures, file loss and other errors, check the drivers of the HFM256GD3JX013N regardless of whether it is under Windows 12, 11, 10, etc. or Linux and Apples macOS.